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  july 2009 doc id 15897 rev 1 1/10 10 STTH10LCD06C turbo2 ultrafast - high voltage rectifier for smps features ultrafast switching low reverse current low thermal resistance reduces conduction and switching losses description the STTH10LCD06C uses st turbo2 technology. this device is specially suited for switching power supplies working with interleaved pfcs. table 1. device summary i f(av) 2 x 5a v rrm 600 v t j 175 c v f (typ) 1.25 v t rr (max) 25 ns a1 k a2 a1 k a2 k a1 a2 k a1 a2 to-220ab STTH10LCD06Ct to-220fpab STTH10LCD06Cfp d 2 pak STTH10LCD06Cg-tr www.st.com
characteristics STTH10LCD06C 2/10 doc id 15897 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 1.2 x i f(av) + 0.08 x i f 2 (rms) table 2. absolute ratings (limiting values per diode at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 600 v i f(rms) forward current rms 20 a i f(av) average forward current, = 0.5 t c = 130 c to-220ab, d 2 pa k per diode 5 a per device 10 a t c = 100 c to-220fpab per diode 5 a per device 10 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 45 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal r unaway for a diode on its own heatsink 175 c table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case to-220ab, d 2 pa k 4 . 5 c/w to-220fpab 7.5 table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2 % reverse leakage current t j = 25 c v r = v rrm 1 a t j = 150 c 5 50 v f (2) 2. pulse test: t p = 380 s, < 2 % forward voltage drop t j = 25 c i f = 5 a 2 v t j = 150 c 1.25 1.6 t j = 25 c i f = 10 a 2.35 t j = 150 c 1.55 2 dptot dtj < 1 rth(j-a)
STTH10LCD06C characteristics doc id 15897 rev 1 3/10 table 5. dynamic electrical characteristics symbol parameter test conditions min. typ. max. unit t rr reverse recovery time i f = 0.5 a, i rr = 0.25 a, i r = 1 a, t j = 25 c 25 ns i f = 1 a, di f /dt = -50 a/s, v r = 30 v, t j = 25 c 35 50 i rm reverse recovery current i f = 5 a, di f /dt = -50 a/s, v r = 400 v, t j = 125 c 1.8 2.5 a t fr forward recovery time i f = 5 a, di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 100 ns v fp forward recovery voltage i f = 5 a, di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 5v figure 1. average forward power dissipation versus average forward current (per diode) figure 2. forward voltage drop versus forward current (per diode) 0 2 4 6 8 10 12 01234567 = 1 = 0.1 = 0.2 = 0.5 = 0.05 t = t p /t t p p f(av) (w) i f(av) (a) 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 t j = 25 c (maximum values) t j = 150 c (typical values) i fm (a) v fm (v) t j = 150 c (maximum values) figure 3. relative variation of thermal impedance junction to case versus pulse duration (to-220ab, d 2 pak) figure 4. relative variation of thermal impedance junction to case versus pulse duration (to-220fpab) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 to-220ab d 2 pa k z th(j-c) /r th(j-c) t p (s) single pulse 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 single pulse to-220fpab z th(j-c) /r th(j-c) t p (s)
characteristics STTH10LCD06C 4/10 doc id 15897 rev 1 figure 5. peak reverse recovery current versus di f /dt (typical values, per diode) figure 6. reverse recovery time versus di f /dt (typical values, per diode) 0 1 2 3 4 5 6 7 8 9 10 0 50 100 150 200 250 300 350 400 450 500 i f = i f(av) v r = 400 v t j = 125 c i rm (a) di f /dt (a/s) 0 20 40 60 80 100 120 140 160 180 200 0 50 100 150 200 250 300 350 400 450 500 i f = i f(av) v r = 400 v t j = 125 c t rr (ns) di f /dt (a/s) figure 7. reverse recovery charges versus di f /dt (typical values, per diode) figure 8. reverse recovery softness factor versus di f /dt (typical values, per diode) 0 50 100 150 200 250 300 350 0 50 100 150 200 250 300 350 400 450 500 i f = i f(av) v r = 400 v t j = 125 c di f /dt (a/s) q rr (nc) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 50 100 150 200 250 300 350 400 450 500 i f = i f(av) v r = 400 v t j = 125 c s factor di f /dt (a/s) figure 9. relative variations of dynamic parameters versus junction temperature figure 10. transient peak forward voltage versus di f /dt (typical values, per diode) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 25 50 75 100 125 t j (c) i f = i f(av) v r = 400 v refernce t j = 125 c i rm q rr s factor 0 2 4 6 8 10 12 14 16 18 0 50 100 150 200 250 300 350 400 450 500 i f = i f(av) t j = 125 c di f /dt (a/s) v fp (v)
STTH10LCD06C characteristics doc id 15897 rev 1 5/10 figure 13. thermal resistance junction to ambient versus copper surface under tab figure 11. forward recovery time versus di f /dt (typical values, per diode) figure 12. junction capacitance versus reverse voltage applied (typical values, per diode) 0 20 40 60 80 100 120 140 160 t fr (ns) 0 50 100 150 200 250 300 350 400 450 50 0 i f = i f(av) v r = 1.1 x v f max. t j = 125 c di f /dt (a/s) 1 10 100 c (pf) 1 10 100 1000 v r (v) f = 1 mhz v osc = 30 mv rms t j = 25 c 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 r th(j-a) (c/w) s cu (cm2) d 2 pa k epoxy printed board fr4, copper thickness: 35 m
package information STTH10LCD06C 6/10 doc id 15897 rev 1 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 6. to-220ab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
STTH10LCD06C package information doc id 15897 rev 1 7/10 table 7. to-220fpab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.50 0.045 0.059 f2 1.15 1.50 0.045 0.059 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126 h a b dia l7 l6 l5 f1 f2 f d e l4 g1 g l2 l3
package information STTH10LCD06C 8/10 doc id 15897 rev 1 table 8. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 *
STTH10LCD06C ordering information doc id 15897 rev 1 9/10 3 ordering information 4 revision history table 9. ordering information order code marking package weight base qty. delivery mode STTH10LCD06Ct STTH10LCD06Ct to-220ab 2.23 g 50 tube STTH10LCD06Cg-tr STTH10LCD06Cg d 2 pak 1.48 g 1000 tape and reel STTH10LCD06Cfp STTH10LCD06C to-220fpab 2.04 g 50 tube table 10. document revision history date revision changes 24-jul-2009 1 first issue.
STTH10LCD06C 10/10 doc id 15897 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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